Flexible circuit board (FPC), also known as flexible circuit board, flexible circuit board, its light weight, thin thickness, free bending and folding and other excellent characteristics are favored. However, the domestic quality inspection of FPC mainly relies on manual visual inspection, which is high cost and low efficiency. With the rapid development of the electronics industry, circuit board design is becoming more and more high-precision and high-density, and the traditional manual detection method can no longer meet the production needs, and the automatic detection of FPC defects has become an inevitable trend of industrial development.

Flexible circuit (FPC) is a technology developed by the United States for the development of space rocket technology in the 1970s. It is a printed circuit with high reliability and excellent flexibility made of polyester film or polyimide as the substrate. By embedding the circuit design on a flexible thin plastic sheet, a large number of precision components are embedded in a narrow and limited space. Thus forming a flexible circuit that is flexible. This circuit can be bent and folded at will, light weight, small size, good heat dissipation, easy installation, breaking through the traditional interconnection technology. In the structure of a flexible circuit, the materials composed are an insulating film, a conductor and a bonding agent

FPC characteristics

1, short: assembly time is short

All lines are configured. Eliminate the connection work of extra lines

2, small: the volume is smaller than PCB

Can effectively reduce the volume of the product. Increase the convenience of carrying

3, light: light weight than PCB (hard board)

It can reduce the weight of the final product

4. Thin: thinner than PCB

Can improve the softness. Strengthen the assembly of the three dimensional space in the limited space

Copper Film (Copper Film)

Copper foil: basically divided into electrolytic copper and calendered copper two kinds. Common thicknesses are 1oz 1/2oz and 1/3 oz

Substrate film: Common thickness of 1mil and 1/2mil two kinds.

Glue (adhesive) : thickness depends on customer requirements.

Cover Film

Cover film: for surface insulation. Common thicknesses are 1mil and 1/2 Mil.

Glue (adhesive) : thickness depends on customer requirements.

Release paper: Avoid adhesion of foreign bodies before pressing; Easy to work with.

PI Stiffener Film

Reinforcing plate: reinforcing the mechanical strength of FPC to facilitate surface installation. Common thicknesses range from 3mil to 9mil.

Glue (adhesive) : thickness depends on customer requirements.

Release paper: Avoid adhesion of the adhesive before pressing.

EMI: Electromagnetic shielding film to protect the circuit board from external interference (strong electromagnetic area or vulnerable to interference area).